The inspection of the bottom AOI equipment obtains information such as the defective category and location of NG solder joints such as bridging continuous soldering and empty holes with less solder, which is passed to the selective wave soldering equipment at the lower station through M2M data interaction information to automatically call the repair soldering process parameters and automatically repair the soldering defects on the PCB.

Selective wave soldering equipment is synonymous with PCBA-DIP high reliability soldering. With the intelligent and electrification development of electric vehicles and the massive increase in the application of inverters, the core components of new energy such as photovoltaic and wind power, and the increasing demand for high power components such as IGBT applications, the high thermal energy and reliable soldering process has become the immediate need. The company's iterative development series of selective wave soldering has the process features of low thermal shock, high solder penetration rate and high cleanliness, combined with visual guidance and easy-to-learn software interface to meet the above-mentioned types of reliable soldering process requirements.

· Heavy-duty track reflow system

· High power electromagnetic pump with custom nozzle

· A wide range of IGBT soldering process requirements with shells can be realized

· Visual positioning system, plate bending height measurement module, high reliability soldering guarantee