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QUICK INTELLIGENT EQUIPMENT CO.,LTD.

Soldering assembly/
visual process AOI Intelligent terminal and
Intelligent wear New energy Semiconductor Into the QUICK
Soldering tools and equipment
Selective soldering
Selective soldering
Laser soldering
Laser soldering
FPC hotbar soldering
FPC hotbar soldering
Soldering locking assembly
Soldering locking assembly
Precision dispensing
Precision dispensing
Laser marking
Laser marking
3D AOI & 3D SPI
3D AOI & 3D SPI
3D AOI & 3D SPI
Die Packaging AOI
Module
VCM CCM SIP module MIC module Antenna module Vibrating motor Charging interface PPOG module
Intelligent terminal
Smart phone Intelligent wear
Metaverse
AR/VR眼鏡
BMS hot pressure soldering automated production line
BMS hot pressure soldering automated production line
Automated production line for millimeter wave radar
Automated production line for millimeter wave radar
PTC automated production line
PTC automated production line
ECU automated production line
ECU automated production line
Solutions to semiconductor packaging
Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

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Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

AOI

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

New energy

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Semiconductor

Solutions to semiconductor packaging Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging total solution

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首頁 > Product center > Soldering assembly/visual process > Laser marking
Intelligent anti stupidity and anti re carving Industry minimum laser spot diameter 0.11mm Laser stability: fluctuation rate of output power Customized MES system docking Upper and lower head / three section varus unit Self test reading rate: 100% Laser imported from the United States High-precision visual navigation system Light-weight design laser module
Learn more
Equipment configuration
Double track carving
Double track carving

Direct mount double track    

Independent engraving mode     

Independent transmission plate

Double sided carving of upper and lower heads
Double sided carving of upper and lower heads

A side and B side are engraved at the same time     

100% increase in efficiency

Built-in flap
Built-in flap

Double sided code printing, front and back flip        

Reduce transmission time and improve efficiency by 30%

Minimalist operation interface
Minimalist operation interface

Step by step programming step           

One click point selection design              

Multi module custom barcode editing rules

Application field
1650076847381174

Post package semiconductor engraving

Operating process
Loading machine feeding
Feeding into receiving track
CCDpositioning / code reading
Magnetic levitation platform positioning
Transfer the carrier board to the marking position
Automated laser marking
Base plate cleaning
Feeding into receiving track
CCDdetection and identification
Receiving operation of receiving machine
Post package semiconductor engraving

組445

組446

組447
Post package semiconductor engravingFilter engravingSilicon wheat engraving


More semiconductor industry applications

Soldering assembly/visual process

Soldering tools and equipment Selective soldering Laser soldering FPC hotbar soldering Soldering locking assembly Precision dispensing Laser marking

AOI

3D AOI & 3D SPI Die Packaging AOI

Intelligent terminal and Intelligent wear

Module Intelligent terminal Metaverse

New energy

BMS hot pressure soldering automated production line Automated production line for millimeter wave radar PTC automated production line ECU automated production line

Semiconductor

Thermo-Compression Bonder High Speed Die Bonder Thermo-compression Die Bonder Multifunctional Die Bonder Silver Sintering Vacuum Oven Formic Acid Oven Die Packaging AOI Power device packaging

Electro-optic display

Mini-LED Mini-LED Solution to Mini-LED High speed die bonder Precision dispensing

About QUICK

About QUICK Contact us
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ICP：蘇ICP備18009533號-2

400-789-7899

Changzhou, China

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