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Thermo-Compression Bonder

High accuracy: XY ±1μm@3σ, θ ±0.004°@3σ Active bond head tilt control: coplanarity 1um Fluxless solutions: H2 plasma, no chemical residue

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Application field

AI

High performance computing

High Speed Die Bonder

Cycle time：0.14s/Die XY placement：X,Y：±20μm（3σ）；θ：±3°（3σ） Bonding area：X：8mm（±4mm），Y：90mm

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Application field

Discrete device

Integrated circuit

MEMS, Transducer

Thermo-compression Die Bonder

Compatible with Ag paste & Ag film thermo-compression process UPH: 1K Die bonding accuracy： ±10μm@3σ, θ: ±0.2° @3σ Die bonding pressure：30g-30kg (take the larger value of ±5g or ±5%) Nozzle heating： RT-250℃ Anti-oxidation design Automatic Ag film loading

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Application field

Power semiconductor

New energy vehicle

Multifunctional Die Bonder

Multiple feeding methods: Wafer, Tray, Tape Max 6 nozzles, accuracy :± 25um, Max UPH>6K Supports large jig/carrier up to 330x660mm Automated solder preform cutting & placement Automatic nozzle & ejector pin change, supports multi-wafer and multi-chip mounting

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Application field

Power semiconductor

New energy vehicle

Silver Sintering

On-line silver sintering equipment

Off-line silver sintering equipment

Capable of small batch and mass production for multiple models Supports universal/specific toolings, with quick tool replacement Sintering area: Max. 350*270mm Sintering pressure: Max. 30MPa Sintering temperature: Max. 350°C Supported processes: Die, DTS, Clip, Module and Wafer sintering Full-process anti-oxidation protection, compatible with copper sintering

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Application field

Power semiconductor

New energy vehicle

Vacuum Oven

Vacuum soldering system

High temperature solder paste process is supported Soldering process temperature Max 450℃ The lifting transmission is stable and vibration-free The void control can be as low as 1% Temperature uniformity ±3.5℃ Split flux management system

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Application field

Power semiconductor

Automotive

Aerospace

Formic Acid Oven

Four-chamber design for higher productivity Supports high-temperature solder preform process Max temperature 450°C, temperature uniformity ±5°C High-efficiency formic acid injection and management system with low formic acid consumption Void ratio of soldering joint can be as low as 1%

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Application field

Power Semiconductor

Automotive

Industrial

Die Packaging AOI

Dual-Resolution Optical System Multi-Angle Shadowless Light Source Ultra DoF Fusion Technology AI Programming

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Application field

Photoelectric Component

Power Module

T/R Module

Die Packaging